COEP Technological University, in collaboration with SemiX IIT Bombay and The IET Pune Local Network, is hosting a Train-the-Trainer workshop on Semiconductor Packaging under the University Affiliate Program (UAP).
Learn about 2.5D/3D interconnects, semiconductor packaging processes, thermal management, and high-density substrates, along with insights into COEP Tech’s SMT Line and a lab infrastructure tour.
- Advanced Packaging Workshop Brochure
- Date: 14 March 2026
Venue: COEP Technological University, Pune
Time: 9:00 AM – 5:30 PM - Lead Instructor: Pradeep Dixit, IIT Bombay
Featured Talk: Dr. Shrinivas Mahajan, COEP Technological University - Registration Fee: ₹500
Register: Click Here - Limited seats – Registrations closing soon.
Eligibility: Faculty members from academic institutions only.
